Copper Plating

The copper manufactured in our facilities is characterised by its high purity (99.9%) with a fine and compact granular structure that prevents the formation of pores, pitting or dendritic growths on the surface of the part to be coated. This results in a homogeneous and compact copper metallic layer, suitable for a wide range of materials, which provides extra protection against corrosion or flaking.

It is deposited in a very wide range of thicknesses, from 0.01mm to 20mm, both for decorative and engineering purposes.

PROPERTIES

Highly conductive of heat and electrical current, superior to aluminium and second only to silver.
Corrosion protection
Brilliant, gives lustre to surfaces
Antibacterial properties
Machinable
High ductility with the ability to expand and contract with temperature making it easy to adapt to any substrate without cracking, blistering or flaking.